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| Part Number | MFG | Package | D/C | |
| SY100S302FC | Microchip Technology | 24-CQFlatpack，Cerpack | 22+ | |
| SN74LVC1G98YEAR | TI | 6-XFBGA，DSBGA | 22+ | |
| SN74LV8151PWG4 | TI | 24-TSSOP（0.173，4.40mm 宽） | 22+ | |
| 74LVC1G57GN | 132" | NXP USA Inc. | 6-XFDFN | |
| NB7L86AMNHTBG | ON | 16-VFQFN 裸露焊盘 | 22+ | |
| SN74LV8151PWRE4 | TI | 24-TSSOP（0.173，4.40mm 宽） | 22+ | |
| 74AUP2G58GF115 | NXP USA Inc. | 10-XFDFN | 22+ | |
| 74AUP2G57GU115 | NXP USA Inc. | 10-XFQFN | 22+ |
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