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| Part Number | MFG | Package | D/C | |
| DS25CP152QSQ/NOPB | National Semiconductor | 16-WFQFN 裸露焊盘 | 22+ | |
| QS3VH384PAG | IDT, Integrated Device Technology Inc | 24-TSSOP（0.173，4.40mm 宽） | 22+ | |
| 74HC153FP-E | Renesas Electronics America Inc | - | 22+ | |
| CD74HCT137EE4 | TI | 16-DIP（0.300，7.62mm） | 22+ | |
| DM74LS138M | National Semiconductor | 16-SOIC（0.154，3.90mm 宽） | 22+ | |
| CD74HCT139EE4 | TI | 16-DIP（0.300，7.62mm） | 22+ | |
| TC74VHC238FK(EL | K)" | Toshiba Semiconductor and Storage | 16-VFSOP（0.118，3.00mm 宽） | |
| NC7SZ157FHX | ON | 6-UFDFN | 22+ |
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