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| Part Number | MFG | Package | D/C | |
| 74HC238DB | 112" | NXP USA Inc. | 16-SSOP（0.209，5.30mm 宽） | |
| SN74CBT3861PWR | TI | 24-TSSOP（0.173，4.40mm 宽） | 22+ | |
| SN74LVC2G157YZPR | TI | 8-XFBGA，DSBGA | 22+ | |
| 74HC138DB112 | Nexperia USA Inc. | 16-SSOP（0.209，5.30mm 宽） | 22+ | |
| SN74AHC139RGYR | TI | 16-VFQFN 裸露焊盘 | 22+ | |
| SY89543LMG-TR | Microchip Technology | 32-VFQFN 裸露焊盘，32-MLF? | 22+ | |
| CD74HC4515M96 | TI | 24-SOIC（0.295，7.50mm 宽） | 22+ | |
| SN74CB3Q3257DGVR | TI | 16-TFSOP（0.173，4.40mm 宽） | 22+ |
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