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| Part Number | MFG | Package | D/C | |
| CBT3245APW | 112" | NXP USA Inc. | 20-TSSOP（0.173，4.40mm 宽） | |
| BCM56174B0IFSBG | Broadcom Limited | - | 22+ | |
| AD8155ACPZ-R7 | Analog Devices Inc. | 64-VFQFN 裸露焊盘，CSP | 22+ | |
| MC10EP56MNG | ON | 20-VFQFN 裸露焊盘 | 22+ | |
| SN74AS298AN | TI | 16-DIP（0.300，7.62mm） | 22+ | |
| 74AC11257DW | TI | 20-SOIC（0.295，7.50mm 宽） | 22+ | |
| QS3VH16245PAG8 | Renesas Electronics America Inc | 48-TFSOP（0.240，6.10mm 宽） | 22+ | |
| SN74CBT34X245DBBR | TI | 80-TFSOP（0.240，6.10mm 宽） | 22+ |
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