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| Part Number | MFG | Package | D/C | |
| BCM56172B0IFSBG | Broadcom Limited | - | 22+ | |
| SY55858UHG-TR | Microchip Technology | 32-TQFP 裸露焊盘 | 22+ | |
| SY89546UMG | Microchip Technology | 32-VFQFN 裸露焊盘，32-MLF? | 22+ | |
| SY58610UMG-TR | Microchip Technology | 16-VFQFN 裸露焊盘，16-MLF? | 22+ | |
| SY89843UMG-TR | Microchip Technology | 24-VFQFN 裸露焊盘，24-MLF? | 22+ | |
| SN74ALS137AD | TI | 16-SOIC（0.154，3.90mm 宽） | 22+ | |
| SY100EL56VZG | Microchip Technology | 20-SOIC（0.295，7.50mm 宽） | 22+ | |
| SN74CBTLV16210DL | TI | 48-BSSOP（0.295，7.50mm 宽） | 22+ |
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