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| Part Number | MFG | Package | D/C | |
| TEA6360T/V2 | 518" | NXP USA Inc. | 32-SOIC（0.295，7.50mm 宽） | |
| BD3808FS-E2 | Rohm Semiconductor | - | 22+ | |
| BD3806AFS-E2 | Rohm Semiconductor | - | 22+ | |
| BD3429K-E2 | Rohm Semiconductor | - | 22+ | |
| STA326JTR | STMicroelectronics | 36-BSSOP（0.433，11.00mm 宽）裸露焊盘 | 22+ | |
| M82710G-14 | MACOM Technology Solutions | 484-BGA | 22+ | |
| SB3231-E1 | ON | 25-FLGA | 22+ | |
| LC75410ES-E | ON | - | 22+ |
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