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| Part Number | MFG | Package | D/C | |
| LM358MX | ON | 8-SOIC（0.154，3.90mm 宽） | 22+ | |
| LM7321QMFE/NOPB | TI | 表面贴装型 | 22+ | |
| SA5212AD/01 | 112" | NXP USA Inc. | 8-SOIC（0.154，3.90mm 宽） | |
| NE5232N/01 | 112" | NXP USA Inc. | 8-DIP（0.300，7.62mm） | |
| AS2333FGE-7 | Diodes Incorporated | 8-UDFN 裸露焊盘 | 22+ | |
| HA1630S05CMEL-E | Renesas Electronics America Inc | - | 22+ | |
| SG143T | Microchip Technology | TO-99-8 金属罐 | 22+ | |
| MAX4462HEUT+T | Maxim Integrated | SOT-23-6 | 22+ |
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