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| Part Number | MFG | Package | D/C | |
| LM301ADT | STMicroelectronics | 8-SOIC（0.154，3.90mm 宽） | 22+ | |
| TSV358AID | STMicroelectronics | 8-SOIC（0.154，3.90mm 宽） | 22+ | |
| SY88307BLMG | Microchip Technology | 16-VFQFN 裸露焊盘，16-MLF? | 22+ | |
| MCP602-I/P | Microchip Technology | 8-DIP（0.300，7.62mm） | 22+ | |
| NCV213RSQT2G | ON | 6-TSSOP，SC-88，SOT-363 | 22+ | |
| LMV321IDCKT | TI | 5-TSSOP，SC-70-5，SOT-353 | 22+ | |
| TLV379IDBVT | TI | SOT-23-5 细型，TSOT-23-5 | 22+ | |
| MC33171DT | STMicroelectronics | 8-SOIC（0.154，3.90mm 宽） | 22+ |
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