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| Part Number | MFG | Package | D/C | |
| TLV2771CDR | TI | 8-SOIC（0.154，3.90mm 宽） | 22+ | |
| TLV2442QPWRG4 | TI | - | 22+ | |
| MCP6N11T-005E/SN | Microchip Technology | 8-SOIC（0.154，3.90mm 宽） | 22+ | |
| MCP665-E/UN | Microchip Technology | 10-TFSOP，10-MSOP（0.118，3.00mm 宽） | 22+ | |
| TLE2021CPG4 | TI | 8-DIP（0.300，7.62mm） | 22+ | |
| ISL28230FRZ-T7 | Renesas Electronics America Inc | 8-VDFN 裸露焊盘 | 22+ | |
| ISL28230FRZ | Renesas Electronics America Inc | 8-VDFN 裸露焊盘 | 22+ | |
| MCP662T-E/MF | Microchip Technology | 8-VDFN 裸露焊盘 | 22+ |
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