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| Part Number | MFG | Package | D/C | |
| LPC660AIM | TI | 14-SOIC（0.154，3.90mm 宽） | 22+ | |
| LMP2012MA | TI | 8-SOIC（0.154，3.90mm 宽） | 22+ | |
| LMC6462AIN | TI | 8-DIP（0.300，7.62mm） | 22+ | |
| ISL28617FVZ-T7 | Renesas Electronics America Inc | 24-TSSOP（0.173，4.40mm 宽） | 22+ | |
| PB63DP | Apex Microtechnology | 12-PowerSIP | 22+ | |
| LA6324NM-TLM-E | ON | 16-DIP（0.300，7.62mm） | 22+ | |
| MAX4372HEBT+TG45 | Maxim Integrated | 5-WFBGA，CSPBGA | 22+ | |
| ISL28127FRTBZ | Renesas Electronics America Inc | 8-WDFN 裸露焊盘 | 22+ |
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