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| 型号 | 厂家 | 封装 | 批号 | |
| BU2363FV-E2 | Rohm Semiconductor | 16-LSSOP（0.173，4.40mm 宽） | 22+ | |
| BU7322HFV-TR | Rohm Semiconductor | 6-SMD，扁平引线裸焊盘 | 22+ | |
| BBT3821-JH | Renesas Electronics America Inc | 192-EBGA | 22+ | |
| BU7328HFV-TR | Rohm Semiconductor | - | 22+ | |
| BU2365FV-E2 | Rohm Semiconductor | - | 22+ | |
| BU2360FV-FE2 | Rohm Semiconductor | - | 22+ | |
| BU3076HFV-TR | Rohm Semiconductor | 6-SMD，扁平引线裸焊盘 | 22+ | |
| BU2396KN-E2 | Rohm Semiconductor | 20-VFQFN 裸露焊盘 | 22+ | |
| BCM55030SB01 | Broadcom Limited | - | 22+ | |
| BQ48SH-28X6NSH | Texas Instruments | - | 22+ |
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