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| 型号 | 厂家 | 封装 | 批号 | |
| GS1524-CTDE3 | Semtech Corporation | 16-SOIC（0.154，3.90mm 宽） | 22+ | |
| GS1660-IBE3 | Semtech Corporation | 100-LBGA | 22+ | |
| GS6152-INTE3 | Semtech Corporation | 48-VFQFN 裸露焊盘 | 22+ | |
| BU1521GVW-E2 | Rohm Semiconductor | 63-VFBGA | 22+ | |
| S1D13742F01A200 | Epson Electronics America Inc-Semiconductor Div | 144-LQFP | 22+ | |
| TW8836AT-LB2-GE | Renesas Electronics America Inc | 128-LQFP 裸露焊盘 | 22+ | |
| RAA2788423HFP#HA0 | Renesas Electronics America Inc | 128-LQFP 裸露焊盘 | 22+ | |
| GS1678-INTE3 | Semtech Corporation | 16-VQFN 裸露焊盘 | 22+ | |
| S1D13746F01A600-90 | Epson Electronics America Inc-Semiconductor Div | 128-LQFP | 22+ | |
| AP0102AT2L00XPGA0-DR | ON | 100-VFBGA | 22+ |
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