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型号 | 厂家 | 封装 | 批号 | |
TDA20137/1 | 557" | NXP USA Inc. | 56-VFQFN 裸露焊盘 | |
TDA18254HN/C1 | 557" | NXP USA Inc. | 48-VFQFN 裸露焊盘 | |
TDA9984AHW/15/C181 | NXP USA Inc. | 80-TQFP 裸露焊盘 | 22+ | |
M21215G-16 | MACOM Technology Solutions | 64-LQFP | 22+ | |
M21204G-15 | MACOM Technology Solutions | 16-SOIC(0.154,3.90mm 宽) | 22+ | |
GS9064ACTDE3 | Semtech Corporation | 16-SOIC(0.154,3.90mm 宽) | 22+ | |
FMS6410BCSX | ON | 8-SOIC(0.154,3.90mm 宽) | 22+ | |
SI21692-B40-GMR | Silicon Labs | 68-VFQFN 裸露焊盘 | 22+ | |
SI2155-B30-GMR | Silicon Labs | 32-VFQFN 裸露焊盘 | 22+ | |
LM1881N | TI | 8-DIP(0.300,7.62mm) | 22+ |
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