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| 型号 | 厂家 | 封装 | 批号 | |
| DF38002H10V | Renesas Electronics America Inc | 64-BQFP | 22+ | |
| DSPIC33EP512GM706T-I/PT | Microchip Technology | 64-TQFP | 22+ | |
| DSPIC33EP128GM310T-I/PT | Microchip Technology | 100-TQFP | 22+ | |
| DSPIC33EV128GM004-E/MLVAO | Microchip Technology | 44-VQFN 裸露焊盘 | 22+ | |
| DSPIC33EP512MC204T-E/ML | Microchip Technology | 44-VQFN 裸露焊盘 | 22+ | |
| DSPIC33EP512MC202T-E/MM | Microchip Technology | 28-VQFN 裸露焊盘 | 22+ | |
| DSPIC33EP512GP504T-E/PT | Microchip Technology | 44-TQFP | 22+ | |
| DSPIC33FJ06GS202AT-E/TL | Microchip Technology | 36-VFTLA 裸露焊盘 | 22+ | |
| DSPIC33EP32MC503-E/TL | Microchip Technology | 36-VFTLA 裸露焊盘 | 22+ | |
| DSPIC33EP32MC204T-E/ML | Microchip Technology | 44-VQFN 裸露焊盘 | 22+ |
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