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型号 | 厂家 | 封装 | 批号 | |
TLV9002IDSGR | TI | 8-WFDFN 裸露焊盘 | 22+ | |
OPA348AIDCKR | TI | 5-TSSOP,SC-70-5,SOT-353 | 22+ | |
MCP6001T-E/OT | Microchip Technology | SC-74A,SOT-753 | 22+ | |
MCP6001T-I/LT | Microchip Technology | 5-TSSOP,SC-70-5,SOT-353 | 22+ | |
THS3062DGNG4 | TI | 8-TSSOP,8-MSOP(0.118,3.00mm 宽)裸露焊盘 | 22+ | |
TLV2451IDBVT | TI | SC-74A,SOT-753 | 22+ | |
LMC7101AIM5 | National Semiconductor | SC-74A,SOT-753 | 22+ | |
LT1215ACN8#PBF | Analog Devices Inc. | 8-DIP(0.300,7.62mm) | 22+ | |
AD8555ARZ-REEL7 | Analog Devices Inc. | 8-SOIC(0.154,3.90mm 宽) | 22+ | |
TLV379IDR | TI | 8-SOIC(0.154,3.90mm 宽) | 22+ |
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