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型号 | 厂家 | 封装 | 批号 | |
S1D13715B00C10B | Epson Electronics America Inc-Semiconductor Div | 161-VFBGA,FCBGA | 22+ | |
MAX4814EECB+T | Maxim Integrated | 64-TQFP 裸露焊盘 | 22+ | |
FMS6243MTC14X | ON | 14-TSSOP(0.173,4.40mm 宽) | 22+ | |
SN761681DBT | TI | 30-TFSOP(0.173,4.40mm 宽) | 22+ | |
SN761672ADARG4 | TI | 32-TSSOP(0.240,6.10mm 宽) | 22+ | |
LM1269NA/NOPB | TI | 24-DIP(0.300,7.62mm) | 22+ | |
FMS6419MSA28 | ON | 28-SSOP(0.209,5.30mm 宽) | 22+ | |
FMS6146MTC14 | ON | 14-TSSOP(0.173,4.40mm 宽) | 22+ | |
EL4581CN | Renesas Electronics America Inc | 8-DIP(0.300,7.62mm) | 22+ | |
NJM2296D | NJR Corporation/NJRC | 16-DIP | 22+ |
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