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| 型号 | 厂家 | 封装 | 批号 | |
| DSC557-0343SI1T | Microchip Technology | 16-TSSOP（0.173，4.40mm 宽） | 22+ | |
| DSC557-04333KI1T | Microchip Technology | 20-VFQFN 裸露焊盘 | 22+ | |
| DSC557-0334FI1T | Microchip Technology | 14-VFQFN 裸露焊盘 | 22+ | |
| DS26503LN+ | Maxim Integrated | 64-LQFP | 22+ | |
| DS26502LN+ | Maxim Integrated | 64-LQFP | 22+ | |
| DS26502L | Maxim Integrated | - | 22+ | |
| DSC557-0334SI1T | Microchip Technology | 14-VFQFN 裸露焊盘 | 22+ | |
| DSC557-054444KI1T | Microchip Technology | 20-VFQFN 裸露焊盘 | 22+ | |
| DSC557-0344FE1T | Microchip Technology | 14-VFQFN 裸露焊盘 | 22+ | |
| DSC557-0344FE0 | Microchip Technology | 14-VFQFN 裸露焊盘 | 22+ |
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