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更多>现货热卖
| 型号 | 厂家 | 封装 | 批号 | |
| S1D13515F00A100 | Epson Electronics America Inc-Semiconductor Div | 256-LQFP | 22+ | |
| VSP2101YG4 | TI | 48-LQFP | 22+ | |
| ADV7619KSVZ-P | Analog Devices Inc. | 128-TQFP 裸露焊盘 | 22+ | |
| RAA2788433HFP#HA0 | Renesas Electronics America Inc | 128-LQFP 裸露焊盘 | 22+ | |
| S1D13743F00A200 | Epson Electronics America Inc-Semiconductor Div | 144-LQFP | 22+ | |
| MAX3815CCM+TD | Maxim Integrated | 48-TQFP 裸露焊盘 | 22+ | |
| GS12081-INE3 | Semtech Corporation | 40-VFQFN 裸露焊盘 | 22+ | |
| AD8124ACPZ-RL | Analog Devices Inc. | 40-WFQFN 裸露焊盘，CSP | 22+ | |
| TW8816-LB3-GRT | Renesas Electronics America Inc | 128-LQFP | 22+ | |
| ISL79985IRZ-T | Renesas Electronics America Inc | 48-VFQFN 裸露焊盘 | 22+ |
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